SensorDynamics provides fail-safe micro and wireless sensor system integration for automotive & industrial applications based upon TS 16949. SensorDynamics acts as semi-fabless semiconductor company, managing the complete product cycle from system specification, through development, to production and shipment.
SensorDynamics secures the services of international cooperation partners who excel in their fields.
SensorDynamics products employ proven state-of-the art process and packaging technologies:
- Thick polysilicon MEMS process based on proprietary process IPs
- Mixed-signal CMOS 0.35 / 0.18 µm process with non-volatile memory
- BCD / SOI 0.35 / 0.18 µm process with non-volatile memory
- Standard and advanced multi chip module packaging
SensorDynamics offer product, system and design know-how in the following areas by leveraging knowledge base and design reuse. |